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现货供应IC MBRD835LG

当 前 价:电议
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有效期至: 2012年12月13日

共有 53 条同类“未分组”产品信息

详细信息

品牌 PH 型号 BGW200EG/01
封装 DIP 批号 最新批次
类型 其他IC

The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN)
System-in-a-Package (SiP) solution optimized for battery-powered handheld
devices. It enables consumers to connect to the growing number of
WLAN networks in offices, homes, and public places. It also allows service
providers to increase their network reach and customer base, enabling
complementary data and voice services across cellular/PCS and WLAN
networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless
integration with Philips Bluetooth solutions.
The SiP format, with its complete system functionality, delivers quicker
design cycles, lower risk, simplified manufacturing, and a reduced bill of
materials. The single-package format also simplifies assembly and testing,
and reduces yield losses. The SiP delivers a complete, fully tested implementation
of 802.11b functionality, so development teams can focus their
energy on innovative product design instead of solving complex issues
related to RF layout.

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